JPH0270522U - - Google Patents
Info
- Publication number
- JPH0270522U JPH0270522U JP14849088U JP14849088U JPH0270522U JP H0270522 U JPH0270522 U JP H0270522U JP 14849088 U JP14849088 U JP 14849088U JP 14849088 U JP14849088 U JP 14849088U JP H0270522 U JPH0270522 U JP H0270522U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- package
- acoustic wave
- surface acoustic
- wave device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000010897 surface acoustic wave method Methods 0.000 claims 2
- 238000002788 crimping Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14849088U JPH0270522U (en]) | 1988-11-16 | 1988-11-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14849088U JPH0270522U (en]) | 1988-11-16 | 1988-11-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0270522U true JPH0270522U (en]) | 1990-05-29 |
Family
ID=31419863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14849088U Pending JPH0270522U (en]) | 1988-11-16 | 1988-11-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0270522U (en]) |
-
1988
- 1988-11-16 JP JP14849088U patent/JPH0270522U/ja active Pending